Analysis of selective bonding processes using reactive multi-layers for system integration on LTCC based SiPs

Abstract

This paper discusses the use of reactive multi-layers for selective assembly of ICs (Integrated Circuits) in an LTCC (Low Temperature Co-fired Ceramics) based SiP (System-in-Package). To understand the requirements for the use of selfpropagating reactive multilayers in die bonding, CFD (Computational Fluid Dynamics) simulations have been carried out to simulate the die bonding process of a silicon chip onto a ceramic LTCC substrate. Reactive foils of 40 and 80 lm thicknesses and a simulated reaction propagation speed of 1 m/s were studied and used to melt a solder preform underneath a silicon chip. The results of the CFD simulations were analysed, particularly with respect to temperature and liquid fraction contours, as well as time–temperature histories obtained from temperature probes which were included in the model, such as to approximate the real behaviour of Pt-100 temperature probes, when a real bonding process is being tracked. The CFD method, in this instance realised with ANSYS Fluent software, can track the melting and solidification of the solder as well as model the influence of latent heat, which is crucial to ascertaining the true evolution of the bonding process.