Impact of Bonding Pressure on the Reactive Bonding of LTCC Substrates

Abstract

Reactive bonding can overcome the issues associated with conventional soldering processes, such as potential damage to heat-sensitive components and the creation of thermomechanical stress due to differing coefficients of thermal expansion. The risk of such damage can be reduced by using localized heat sources like reactive multilayer systems (RMS), which is already a well-established option in the field of silicon or metal bonding. Adapting this process to other materials, such as low temperature co-fired ceramics (LTCC), is difficult due to their differing properties, but it would open new technological possibilities. One aspect that significantly affects the quality of the bonding joints is the pressure applied during the bonding process. To investigate its influence more closely, various LTCC samples were manufactured, and cross-sections were prepared. The microscopical analysis reveals that there is an optimum range for the bonding pressure. While too little pressure results in the formation of lots of voids and gaps, most likely in poor mechanical and electrical properties, too high pressure seems to cause a detachment of the metallization from the base material.