Please use this identifier to cite or link to this item: doi:10.22028/D291-24498
Title: Sol-gel synthesis of a diepoxy-crosslinked ormocer adhesive for Cu/polyimide sealing systems
Author(s): Kasemann, Reiner
Burkhart, Thomas
Schmidt, Helmut K.
Language: English
Year of Publication: 1995
OPUS Source: Sol-gel science and technology : [proceedings of the First International Symposium on Sol-Gel Science and Technology, held October 19-22, 1994, in Los Angeles] / ed. by Edward J. A. Pope. - Westerville, Ohio : American Ceramic Society, 1995. — (Ceramic transactions ; 55), S. 307-314
SWD key words: Sol-Gel-Verfahren
Dielektrische Eigenschaft
DDC notations: 620 Engineering and machine engineering
Publikation type: Conference Paper
Abstract: Sol-gel-derived ORMOCER adhesives starting from methyl-vinyl silanes, diphenyl silanes and tetraethoxy silanes with tailored strain dissipation properties have been synthesized and tailored as hot-melt sealing adhesives for Cu to polyimide. In order to establish an appropriate strain dissipation mechanism within the brittle ORMOCER systems used as starting materials, an organic polymer chain based crosslinking reaction, linking amino groupings bonded to silanes together with difunctional epoxides was investigated. For controlling the process, spectroscopic data were used and correlated to peel strength. The system shows a peel strength of 10 N/cm, good dielectric properties and a high heat stability.
Link to this record: urn:nbn:de:bsz:291-scidok-28080
ISBN: 0-944904-97-1
Date of registration: 24-Mar-2010
Faculty: SE - Sonstige Einrichtungen
Department: SE - INM Leibniz-Institut für Neue Materialien
SciDok - Der Wissenschaftsserver der Universität des Saarlandes

Files for this record:
File Description SizeFormat 
sm199516.pdf359,15 kBAdobe PDFView/Open

Items in SciDok are protected by copyright, with all rights reserved, unless otherwise indicated.