Please use this identifier to cite or link to this item: doi:10.22028/D291-24481
Title: Synthesis of high performance Cu/polyimide adhesives based on inorganic-organic composite materials
Author(s): Kasemann, Reiner
Burkhart, Thomas
Schmidt, Helmut K.
Language: English
Year of Publication: 1994
OPUS Source: Adhesives in electronics '94 / First International Conference on Adhesive Joining Technology in Electronics Manufacturing, Berlin, November 2 - 4, 1994. VDI/VDE-IT; EG-Verbindungsbüro für Forschung und Technologie. — [Teltow : VDI-VDE-Technologiezentrum Informationstechnik], 1994, S. 1-9
SWD key words: Polyimide
DDC notations: 620 Engineering and machine engineering
Publikation type: Conference Paper
Abstract: Sealing of Cu to polyimide in a hot melt process is difficult due to the very different surface properties of Cu and polyimide. Silicone-based systems are widely used due to their heat resistance, but their sealing strength is still rather low. A new hot melt system has been developed by using silane-based oligomers with polar groups (-OH and -NH2) to provide good adhesion and aromatic epoxy units to tailor the stress dissipation ability of the system during the peel test. The system is cured by heat, shows a peel strength of 10 N/cm and is stalbe up to 180 °C. The synthesis principles and the general properties of the system as well as the sealing performance are described.
Link to this record: urn:nbn:de:bsz:291-scidok-27897
Date of registration: 19-Mar-2010
Faculty: SE - Sonstige Einrichtungen
Department: SE - INM Leibniz-Institut für Neue Materialien
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