Please use this identifier to cite or link to this item: doi:10.22028/D291-23806
Title: Investigation of the stresses in continuous thin films and patterned lines by x-ray diffraction
Author(s): Kuschke, Wolf-Michael
Arzt, Eduard
Language: English
Year of Publication: 1994
OPUS Source: Applied physics letters. - 64. 1994, 9, S. 1097-1099
SWD key words: Röntgenstrahlung
DDC notations: 620 Engineering and machine engineering
Publikation type: Journal Article
Abstract: Strains and stresses in aluminum thin films and patterned lines were measured using x-ray diffraction. Measurements were performed on pure aluminum and on ion-implanted aluminum, as annealed and six months after an annealing treatment. The results suggest that stresses in passivated lines, starting from an unequitriaxial state of stress, show the tendency to relax in the direction of an equitriaxial state of stress, depending on the ratio of grain size and linewidth or film thickness. The relaxation is particularly rapid in ion-implanted aluminum lines, in contradiction to the expected strengthening effect. Possible implications for electromigration resistance are discussed.
Link to this record: urn:nbn:de:bsz:291-scidok-17479
Date of registration: 14-Nov-2008
Faculty: SE - Sonstige Einrichtungen
Department: SE - INM Leibniz-Institut für Neue Materialien
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