Please use this identifier to cite or link to this item: doi:10.22028/D291-23805
Title: Electromigration failure by shape change of voids in bamboo lines
Author(s): Arzt, Eduard
Kraft, Oliver
Nix, William D.
Sanchez, J. E.
Language: English
Year of Publication: 1994
OPUS Source: Journal of applied physics. - 76. 1994, 3, S. 1563-1571
SWD key words: Elektromigration
DDC notations: 620 Engineering and machine engineering
Publikation type: Journal Article
Abstract: The behavior of electromigration-induced voids in narrow, unpassivated aluminum interconnects is examined, using scanning electron microscopy. Some electromigration tests were interrupted several times in order to observe void nucleation, void growth, and finally the failure of the conductor line. It is found that voids which opened the line have a specific asymmetric shape with respect to the electron flow direction. Besides void nucleation and void growth, void shape changes can consume a major part of the lifetime of the conductor line. A first attempt to model these processes on the basis of diffusion along the void surface shows that voids with a noncircular initial shape tend to produce the fatal asymmetry due to electron wind effects, with the anisotropy of surface energy possibly playing only a minor role.
Link to this record: urn:nbn:de:bsz:291-scidok-17468
Date of registration: 12-Nov-2008
Faculty: SE - Sonstige Einrichtungen
Department: SE - INM Leibniz-Institut für Neue Materialien
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